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Synova Laser MicroJet
LDS 300 M
Synova was founded by Richer Hagen in 1997 in Lausanne to make the patented Laser MicroJet (LMJ) technology available to high-tech industrial manufacturers. The major unique advantage of LMJ is not HAZ (Heat Affected Zoon) during the processing.
https://www.synova.ch
Brand
The Laser Dicing System is primarily designed for semiconductor back-end processing; mainly wafer dicing and scribing applications. The LDS 300 M requires manual loading. Wafer alignment and kerf check are performed automatically. Synova’s new 300 mm (12”) wafer dicing system integrates a maintenance free fiber laser.
Application
Specification
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